LTS -20℃~80℃ Fluoride cooling and heating system

Temperature control during semiconductor manufacturing

Flow control12L/min~45L/min
Internal circulating liquid4L~10L
Expansion tank10L~20L
Place of OriginChina

Fluorinated liquid temperature control LTS series semiconductor test chiller

Product data download

manual.pdf

Parameters Detailed

Model	LTS-202	LTS-203	LTS-204	LTS-206	LTS-208
	LTS-202W	LTS-203W	LTS-204W	LTS-206W	LTS-208W
Temperature range	-20℃～35℃
Temperature control accuracy	±0.1℃ at -20℃～0℃
Flow control	7～25L/min		12～45L/min
	The flow control adopts frequency converter adjustment, and the speed is automatically adjusted according to the feedback signal of the flow sensor. The maximum pressure of the circulating pump is 5bar.
Internal circulating fluid volume	4L	5L	6L	8L	10L
Expansion tank volume	10L	10L	15L	15L	20L
System pressure display	The pressure of the refrigeration system is realized by a pointer pressure gauge (high pressure, low pressure)
	The pressure acquisition outlet position of the circulatory system is detected by a pressure sensor and displayed on the touch screen
Controller	SPLC, fuzzy PID control algorithm, with cascade control algorithm
Temperature control	Heat transfer medium outlet temperature control mode
	External temperature sensor: (PT100 or 4～20mA or communication setting) control mode (cascade control)
Letter of agreement	Ethernet interface TCP/IP protocol
	RS485 interface modbus RTU protocol
Internal temperature feedback of equipment	Equipment heat transfer medium outlet temperature, medium inlet temperature, refrigeration system condensation temperature, ambient temperature, compressor suction temperature, cooling water temperature (available for water-cooled equipment)
Closed circulation system	The whole system is a fully enclosed system, low temperature does not absorb moisture in the air, does not volatilize the heat transfer medium, and the low temperature automatically supplements the heat transfer medium into the circulation system
Compressor	Emerson Copeland/Danfoss Scroll Flexible Compressor
Circulating pump	Magnetic circulation pump
Evaporator	Plate heat exchanger
Condenser	Micro channel condenser (air-cooled)
	Plate heat exchanger (water-cooled), special attention: clean factory water is required
Refrigeration accessories	Danfoss/Emerson accessories (filter drier, oil separator, high and low pressure protector, expansion valve)
Operation panel	LNEYA customized 7-inch color touch screen, temperature curve display\EXCEL data export
Security	With self-diagnosis function; phase sequence open-phase protector, refrigerating machine overload protection; high-pressure pressure switch, overload relay, thermal protection device and other security functions.
In and out interface size	ZG1/2	ZG1/2	ZG3/4	ZG3/4	ZG3/4

Product Description

It is widely used in the semiconductor manufacturing process to control the temperature of the reaction chamber, the temperature of the heat sink, and the temperature control of the non-flammable fluid of the heat transfer medium.

1. The pressure holding test of the medium circulation system is 7 bar.
2. Use high-quality magnetic pump without mechanical shaft seal.
3. Optimize temperature sampling and response speed, specially design control algorithm, can respond quickly to stable temperature control.
4. Enhance the design of the circulating pump capacity to meet the high-lift requirements of the system.
5. Continuous high-temperature cooling technology meets the requirements for stable operation when heat is loaded on the heat sink plate and requires cooling and heating constant temperature control.
6. In view of the volatile characteristics of fluorinated liquid, the joint design and system sealing design are strengthened to ensure the service life of the medium.