Description of heat sink characteristics in chip temperature control

With the continuous development of electronic chips, its heat dissipation technology is also advancing. LNEYA chip temperature control technology is continuously promoted along with chip test equipment.

The development trend of modern computer chips is integration and miniaturization. Computer chip technology has become a core component of modern computer technology. The development of computer technology requires the function of computer chips to be continuously strengthened, so the power consumption of computer chips is increasing. Large, generating a lot of heat, affecting the normal working level of the computer chip. Therefore, how to effectively cool the chip temperature control is an important prerequisite for improving the chip’s capability.

At this stage, in the process of chip temperature control applications, a common and common method of cooling the computer’s electronic chip is to directly cool down with a heat sink such as a fan. The heat sink has great differences in structure, material usage, and manufacturing methods. Therefore, the heat dissipation capability of the heat sink to the electronic chip is also different. However, it is impossible to provide a unified and good evaluation of the heat dissipation level of the radiator by virtue of the existing technical level. Simply relying on the relevant data on the radiator manual is not enough to convince people that the authenticity of the above data needs further investigation.

Chip temperature control is a compressor, a gas storage tank, a constant temperature water tank, a valve, a gas flow meter, a DC power supply, a supply air duct, an analog electronic chip and a heat sink device, a data acquisition device, and a computer. Chip temperature control In order to better carry out experimental control, the chip temperature control adopts a heating chip to simulate an electronic chip to test. In order to be able to control the temperature of the heater chip, several thermocouple copper pieces can be mounted on the heater chip, and then connected to a voltage source for power control of the heater chip. After adjusting the temperature, two completely different heat sinks are used to heat the heater. The film is dissipated, and then the heat generated by the electric heating sheet is blown away by means of air air cooling to simulate the heat sink. Adjusting the speed of the air flow will obtain different heat dissipation effects, and the data acquisition device will obtain relevant data, and the heat dissipation effect of the heat sink can be obtained through the processing of the computer.

Chip temperature control is currently used in modern computer chips and other industry chip tests, and its technology is also maturing, and will become one of the main force of test equipment in the future.

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