Thermal Chuck or Thermal Plate/Thermal Control Unit

MD -75℃～225℃

Direct Cooling Chiller Gas Cooling Chillers Semiconductor Test Chillers

Temperture accuracy±0.1℃
Heating Power-60°C to +25°C: 2 min 0°C to +25°C: 2 min +25°C to +220°C: 6 min
Cooling Power220°C to +25°C: 2 min +25°C to -60°C: 6 min
Source Power2.8KW
Flat ShapeRound/Square

chiller+chuck direct cooling

INQUIRY

Quick temperature change control chuck

-75℃ to 225°C

Configuration Details

Model	MD-708	MD-712	MDL-708
Temp. Range	-75℃～225℃	-75℃～225℃	-75℃～225℃
Temperature control accuracy	±0.1℃	±0.1℃	±0.1℃
temperature uniformity	±1℃	±1℃	±1℃
Flatness	±50um	±50um	±50um
Tablet Size	200mm diameter disc	300mm diameter disc	150mm*200mm
Host and card cable	2.5m (other lengths can be customized)
Flat surface treatment	Electroplated nickel (optional gold plating)
Heat Up	-60°C to +25°C: 2 min 0°C to +25°C: 2 min +25°C to +220°C: 6 min
Cool Down	220°C to +25°C: 2 min +25°C to -60°C: 6 min
Control System	PLC controller, heating feed-forward PID fuzzy algorithm, cooling electronic expansion valve PID adjustment control cooling capacity
Display and Record	7-inch color touch screen, record temperature curve
Communication	Ethernet interface TCP/IP protocol
Refrigeration Compressors	Taikang
Power Supply	220V 50/60HZ 2.8KW	220V 50/60HZ 4.5KW	220V 50/60HZ 2.8KW
Host size mm	550×650×370	550×650×370	550×650×370

Product Description

MD’s greatest innovation in thermal testing is the series of thermally controlled chucks, which are mainly used for performance testing, modeling, process development, design defect or IC failure analysis of semiconductor wafers. It can realize rapid temperature change and precisely control the temperature. The system itself has its own refrigerator, which avoids the consumption of liquid nitrogen, carbon dioxide, etc., and each system includes a chuck and a cold and hot control unit.

The inside of the plate adopts the direct evaporation method of refrigerant, which greatly improves the heat exchange efficiency and the heat exchange power per unit area of the plate compared with the liquid cooling method.

Rapid cooling/heating rates up to 25°C/min

Built-in refrigerator to avoid the consumption of liquid nitrogen, carbon dioxide, etc. Programmable automation, temperature stability +/-0.1℃

Controller provides touch screen and remote interface to precisely control and monitor equipment temperature
Display test status – real-time data

Thermal Chuck MD series provides an open flat surface working platform, rapid temperature rise and fall, and constant temperature control, which can be used for testing RF devices and high-density power devices (IGBTSAND MOSFETS), and can also be used for rapid cooling of laboratory flat panels (plasma, biological products, batteries), etc.

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